Power chips are linked to external circuits via packaging, and their performance depends on the assistance of the packaging. In high-power circumstances, power chips are usually packaged as power modules. Chip affiliation refers to the electric connection on the top surface area of the chip, which is normally light weight aluminum bonding cord in traditional modules. ^
Standard power module bundle cross-section
Presently, business silicon carbide power modules still mostly utilize the packaging technology of this wire-bonded typical silicon IGBT component. They deal with issues such as huge high-frequency parasitical parameters, insufficient warm dissipation ability, low-temperature resistance, and not enough insulation strength, which limit using silicon carbide semiconductors. The screen of superb performance. In order to solve these issues and totally make use of the substantial prospective benefits of silicon carbide chips, numerous brand-new packaging modern technologies and options for silicon carbide power components have actually arised over the last few years.
Silicon carbide power module bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have developed from gold cord bonding in 2001 to aluminum cord (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually created from gold cords to copper cords, and the driving force is cost decrease; high-power devices have actually established from aluminum cords (strips) to Cu Clips, and the driving pressure is to enhance item efficiency. The better the power, the greater the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that utilizes a strong copper bridge soldered to solder to attach chips and pins. Compared with typical bonding packaging techniques, Cu Clip technology has the adhering to benefits:
1. The connection in between the chip and the pins is constructed from copper sheets, which, to a specific level, replaces the basic cable bonding approach between the chip and the pins. Consequently, an one-of-a-kind bundle resistance value, higher present circulation, and better thermal conductivity can be acquired.
2. The lead pin welding area does not need to be silver-plated, which can fully conserve the cost of silver plating and bad silver plating.
3. The product appearance is totally constant with normal items and is mostly utilized in web servers, mobile computer systems, batteries/drives, graphics cards, motors, power products, and other areas.
Cu Clip has 2 bonding methods.
All copper sheet bonding method
Both the Gate pad and the Resource pad are clip-based. This bonding approach is much more pricey and intricate, however it can accomplish better Rdson and much better thermal impacts.
( copper strip)
Copper sheet plus cable bonding technique
The resource pad utilizes a Clip approach, and the Gate uses a Cord approach. This bonding method is somewhat less expensive than the all-copper bonding method, saving wafer location (relevant to extremely tiny gate areas). The process is easier than the all-copper bonding technique and can acquire much better Rdson and much better thermal result.
Vendor of Copper Strip
TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding bare bright copper price, please feel free to contact us and send an inquiry.
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